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Equipment overview

Offshore Electronics
The manufacturing facility at a glance.
  • BS EN ISO9001:2008, IPC-A-610
  • Competitive component procurement.
  • WinMan – Fully integrated MRP / ERP manufacturing system.

For surface mount we offer three separate Philips surface mount lines that consist of:
  • 3 x DEK265 precision screen printers.
  • 2 x Philips Topaz ‘pick & place’ machines for high speed SMD component placement.
  • 2 x Philips Emerald placement machine for fine pitch and BGA components.
  • 1 x Philips Emerald based ‘short run’ and prototype line.
  • 2 x Forced air reflow soldering machines.
  • Automatic Optical Inspection (AOI) equipment.
  • BGA & SMT rework stations.
For conventional through hole and mixed technology assembly we offer:
  • 2 x Amistar AI6448 high speed axial component insertion machines.
  • Universal Multi-mod 6772a high speed DIP insertion machine.
  • Universal RAD5 high speed radial component insertion machine.
  • Blundell CMS400 'no clean' tin lead flow soldering equipment.
  • Blundell CMS400LF 'no clean' lead free flow soldering equipment.
  • Pillarhouse selective soldering equipment.
To complete the assembly process we offer:
  • 2 x Teradyne Z1890 ATE, J-Tag and full functional testing facility.
  • Kerry ultrasonic board washing process.
  • Asymtek automated conformal coating machine.
  • Mixflow epoxy potting machine.
  • Mechanical assembly and full ‘box build’
  • Shipping and logistics.
  • Skilled and dedicated workforce of 65 who are all IPC-A-610 trained and certified.