Surface mount assembly

Three fast and flexible Philips surface mount lines for 0402 — BGA placement. Each automated line consists of a DEK screen printing machine, Philips SMD chip shooter, Philips fine pitch placement machine and forced air reflow soldering equipment.

Controlled processes are the key to achieving a high quality finished product from our three surface mount production lines.All three high specification DEK265 screen printers provide a fully automated, repeatable perfect solder paste print on the PCB to be assembled and with an enclosed air conditioned environment the solder paste retains its optimum consistency.

Once printed the board is transported by conveyer into a GEM Topaz high speed chip shooter. Using 8 heads the Topaz is capable of placing 15,000 components per hour down to a size of 0402. The board then passes to a GEM Emerald which places the high precision parts such as BGAs, QFPs, TSOPs etc.

The process is completed when the board is passed through a forced air reflow oven that reflows the solder paste and forms a perfect soldered joint.

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